Product overview

Immediate start of software development on reference designs

Special evaluation kits enable software development to get started right away, even if the final hardware design has not yet been decided on. All common interfaces of the relevant processor are available here, so that a complete software development can be performed. Once the development is complete, the relevant Trizeps or Myon CPU modules can be integrated quickly and easily into the customer‘s own hardware on the basis of this reference design. Windows 10 IoT Core, Windows Embedded Compact 7 or 2013, Linux and Android operating systems are available.

i-PAN M7 CoverLens Starter-Kit

Snapdragon 410 HMI with POE Evaluation platform for Myon CPU modules

For Myon I with Qualcomm Snapdragon 410E and Myon II / II Nano with NXP i.MX 8M Mini / 8M Nano processors

  • 7.0" TFT Display with capacitive touch, resolution 800 x 480 pixel, brightness 850 cd/qm, non-reflecting surface
  • Supports the following interfaces and features: 10/100 Mbit Ethernet (with POE), USB2.0 Host, μUSB2.0 OTG, μSD Card Socket, Realtime Clock with Backup battery, LED, Powerfail Detection
  • Additional extension interfaces for i-MOD "Breakout-Boards": RS232, RS485, USB, I2C
  • Wireless Communication via Myon I onboard WiFi/Bluetooth modules

pConXS Eval-Kit

NXP iMX6, iMX8 Eval-Kit Evaluation Kit for Trizeps SODIMM 200 CPU modules

For Trizeps VII with NXP i.MX 6 and Trizeps VIII / VIII Mini / VIII Nano with NXP i.MX 8M / 8M Mini / 8M Nano processors

  • 7.0" TFT Display with capacitive touch, resolution 800 x 480 pixel, brightness 350 cd/qm
  • Supports many interfaces, e.g. 10/100 Mbit Ethernet, USB2.0 (4-Port Hub), RS232, analog and MIPI camera, Mini PCIe
  • Additional extension interfaces via SL2-40 pin header, e.g. GPIO, SPDIF, Audio, UARTs, 2x CAN, SDIO, I2C, 3x ADCs
  • Wireless Communication via Trizeps onboard WiFi/Bluetooth modules

ConXT Eval-Kit

NXP i.MX6, i.MX8 Eval-Kit Evaluation Kit for Trizeps SODIMM 200 CPU modules

For Trizeps VII with NXP i.MX 6 and Trizeps VIII / VIII Mini with NXP i.MX 8M / 8M Mini processors

  • 7.0" TFT Display with capacitive touch, resolution 800 x 480 pixel, brightness 350 cd/qm
  • Supports many interfaces, e.g. 2x 10/100 Mbit Ethernet, USB2.0 Host, USB2.0 OTG, COM1 (RS232), COM2 (RS232, RS422 or RS485), 2x CAN, IOs, Analog Camera (Cinch), RTC, Audio 2.6W Amplifier, Microphone
  • Optional: UPS (Uninterruptible Power Supply, max. 100F)
  • Additional extension interfaces via FFC Connector: USB, I2C, GPIOs
  • Wireless Communication via Trizeps onboard WiFi/Bluetooth modules

i-PAN5 Eval-Kit

i-PAN5-7-i.MX6-i.MX8-Evalualtion-Kit-Front-420x349Px.png Evaluation Kit for Trizeps SODIMM 200 CPU modules

For Trizeps VII with NXP i.MX 6 and Trizeps VIII / VIII Mini / VIII Nano with NXP i.MX 8M / 8M Mini / 8M Nano processors

  • 7.0" TFT Display with with capacitive touch or 5.0" display with resistive touch, resolution 800 x 480 pixel
  • Supports many interfaces, e.g. 10/100 Mbit Ethernet, USB2.0 (4-Port Hub), RS232, CAN, RS485, Audio, μSD Card Socket, RTC
  • Additional extension interfaces via SL2-40 pin header, e.g. GPIO, SPDIF, Audio, UART, CAN, SDIO, I2C, ADCs
  • Wireless Communication via Trizeps onboard WiFi/Bluetooth modules

i-PAN7 Eval-Kit

i-PAN7-iMX8,iMX6-Eval-Kit-Front-430x315Px.png Evaluation Kit for Trizeps SODIMM 200 CPU modules

For Trizeps VII with NXP i.MX 6 and Trizeps VIII Mini / VIII Nano with NXP 8M Mini / 8M Nano processors

  • 7.0" display with capacitive or resistive touch, resolution 800 x 480 pixel, brightness 350 cd/qm
  • Depending on the i-PAN7 or Trizeps version, the kit has the following interfaces:: 10/100 Mbit Ethernet, USB2.0 OTG, SD Card Socket, Audio, RTC
  • Additional extension interfaces depending on i-PAN7 or Trizeps version
  • Wireless Communication via Trizeps onboard WiFi/Bluetooth modules