i-PAN T10 CoverLens

NXP i.MX 6 Quad, Dual, DualLite, Solo, SoloX ARM Cortex A9 / 800 MHz – 1.0 GHz

Trizeps VII with i.MX 6 Quad, Dual, DualLite, Solo, SoloX

Up to 4 x 16 Bit DDR3-1066 (533MHz), 16/32/64 Bit 1 CS, 256 MByte to 1 GByte (2, 4 GByte on request)

Onboard 4 Bit wide μSD Socket (on Trizeps VII) for cards up to 32GB (standard) or onboard 8 Bit wide eMMC with 4GB up to 64GB (on request)

Display: 10.1“ TFT-Display, 1280 x 800 pixel, 420 cd/qm, projected capacitive touchscreen, IPS technology, 3 mm glass front

Interfaces FF version (Full Function): USB2.0 Host, μUSB2.0 OTG, RJ45 10/100 Mbit Ethernet, μSD Card Socket, 3,5 mm Headset Jack for Microphone and Headphone, Realtime Clock with Backup battery, LED, Powerfail Detection

Interfaces LC-E version (Low Cost Extended): USB2.0 Host, RJ45 10/100 Mbit Ethernet, Realtime Clock with Backup Cap, LED, Powerfail Detection

Trizeps options: Onboard WLAN and Bluetooth module, IEEE 802.11 a/b/g/n/e/i/h/d/k/r/w, +18 dBm, 72 Mbps (20 MHz) and up to 150 Mbps (40 MHz), Bluetooth 3.0+ EDR

Extension interfaces FF version: FFC connectors with USB, I2C, UART, CAN, Keys, Camera (Rasberry Pi) / Solderpads for SPI, Speaker (2.6 W Audio Amplifier), Headphone, Microphone

Extension interfaces LC version: FFC connector with UART / Solderpads for SPI, Headphone, Microphone

System Software: E-Boot, U-Boot, Barebox / Windows Embedded Compact 7, 2013 – Linux Kernel 3.035, 4.1, 4.4 – Ubuntu 14.04, 16.04, LXDE, Yocto – Android 4.2.2, 6.0

Voltage Supply: Industrial +12 up to +24V supply / only for FF version (optional): Power over Ethernet (POE)

Operating Temperature: -20°C to +70°C

Dimensions i-PAN T10 Baseboard: 130.0 x 100.0 x 17.0 mm (W x H x D)

Dimensions Display: 257.5 x 180.0 x 12.0 mm (W x H x D)

Environmental Standard: RoHS, REACH, WEEE

Availability: 10 years form, function*

Order Codes (incl. i-PAN T10 Baseboard FF or LC, without Trizeps VII):
i-PAN T10 CoverLens FF: 49 400.CL / i-PAN T10 CoverLens LC: 49 100.CL