The Trizeps VII is one of the world‘s most powerful NXP i.MX6 CPU modules and is suitable for multimedia, multitouch and multidisplay applications as well as for demanding control tasks. It uses the full performance potential of the NXP i.MX6 processor with the compact form factor of the SODIMM 200 standard.
Available with Microsoft Windows 10 IoT Core, Windows Embedded Compact 7, 2013, Linux and Android operating systems
Features:
1 NXP i.MX6 ARM Cortex A9 processor (i.MX 6Quad, i.MX 6Dual, i.MX 6DualLite, i.MX 6Solo) – 2 DDR3 RAM – 3 SODIMM 200 connector, interfaces: 24 Bit RGB LCD, 8 Bit Camera, Address Data Bus, USB 2.0 Host, USB 2.0 OTG, 2x FlexCAN, PCI-Express, 3x UARTs, I2C, SPI, GPIOs, PWM, RTC, AC97, headphone out, speaker out, microphone, LineIn, resistive touch, ACDs, 10/100 Mbit Ethernet, 4 Bit SD1 port, PCM, 3V3 power supply – 4 Socket for μSD cards (eMMC optional) – 5 Bluetooth UFL coax connector – 6 WLAN UFL coax connector – 7 WLAN-Bluetooth module (optional) – 8 Power Management IC (PMIC) – 9 SPI NOR Flash up to 512 Mbit (on request) – 10 High-Speed board-to-board connector, 60 pole, interfaces: MIPI camera, MIPI display, SATA-II, Dual-LVDS (WUXGA), HDMI v1.4 (3D, 4k x 2k, 1080p), RGMII 10/100/1000 Mbit – 11 Ethernet Transceiver – 12 Audio Codec / resistive Touch – 13 Ground potential for EMC heat sink connection
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