The Trizeps VII is one of the world‘s most powerful NXP i.MX 6 CPU modules and is suitable for multimedia, multitouch and multidisplay applications as well as for demanding control tasks. It uses the full performance potential of the NXP i.MX 6 processor with the compact form factor of the SODIMM 200 standard.
Available with Microsoft Windows Embedded Compact 7, 2013, Linux and Android operating systems
Features:
1 NXP (before Freescale) i.MX 6 ARM Cortex A9 processor (Quad, Dual, DualLite, Solo) – 2 DDR3 RAM – 3 SODIMM 200 connector, interfaces: 24 Bit RGB LCD, 8 Bit Camera, Address Data Bus, USB 2.0 Host, USB 2.0 OTG, 2x FlexCAN, PCI-Express, 3x UARTs, I2C, SPI, GPIOs, PWM, RTC, AC97, headphone out, speaker out, microphone, LineIn, resistive touch, ACDs, 10/100 Mbit Ethernet, 4 Bit SD1 port, PCM, 3V3 power supply – 4 Socket for μSD cards (eMMC optional) – 5 Bluetooth UFL coax connector – 6 WLAN UFL coax connector – 7 WLAN-Bluetooth module (optional) – 8 Power Management IC (PMIC) – 9 SPI NOR Flash up to 512 Mbit (on request) – 10 High-Speed board-to-board connector, 60 pole, interfaces: MIPI camera, MIPI display, SATA-II, Dual-LVDS (WUXGA), HDMI v1.4 (3D, 4k x 2k, 1080p), RGMII 10/100/1000 Mbit – 11 Ethernet Transceiver – 12 Audio Codec / resistive Touch – 13 Ground potential for EMC heat sink connection
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