Trizeps VII SX

New CPU module with i.MX 6SoloX

The new Trizeps VII CPU module with i.MX 6SoloX processor from NXP (before Freescale). It supports 2 Ethernet interfaces at the same time and has a low power consumption thanks the second Cortex M4 Core.

Trizeps VII 6SoloX Front
Trizeps VII 6solox Back


NXP i.MX 6SoloX ARM Cortex A9 and Cortex M4, 800 MHz up to 1.0 GHz, 256 KB L2-Cache

RAM Memory

2x 16 Bit LVDDR3-1066 (533 MHz), 32 Bit 1 CS

Options: 256 MByte up to 2 GByte, 32 Bit

Flash Storage

Onboard 4 Bit wide μSD Socket (standard) or onboard 8 Bit wide eMMC (on request) – not all available at the same time

Additional assembly option on request: Onboard SPI NOR Flash

Options: μSD 4 GB (up to 32 GB) – eMMC-Type: 4 GB (up to 64 GB) – NOR Flash up to 512 Mbit

Wireless Communication

Onboard WLAN-Bluetooth module, fits four different U-Blox module types (on request)

Options: IEEE 802.11 a/b/g/n/e/i/h/d/k/r/w, +18 dBm, 72 Mbps (20 MHz) and up to 150 Mbps (40 MHz), Bluetooth 3.0+ EDR

Onboard Features

Display Interfaces: LVDS, LCD 24 Bit RGB

Interfaces: USB 2.0 Host and OTG, 2x FlexCAN, PCIe, 4 Bit wide SDIO, RTC, SPDIF, Adress-Data-Bus, 3x UARTs, 2x I2C, 2x SPI, GPIOs, 2x PWMs

Ethernet: Onboard 10/100 Mbit RMII PHY and 10/100/1000 Mbit RGMII interface (can be used at the same time)

Extension Connector: Additional FX11 60pol. high-speed board to board connector

Camera Interfaces: 8bit parallel camera and analog camera interface

Audio Codec: AC´97 Audio Codec with 4/5 wires res. Touch and 4x 12 Bit ADC (2x comparator inputs for battery monitoring), Stereo: Line-in, Mic-in, Speaker-out, Headphone out

Power: High-Eff. PMIC with single supply controlled by I2C, battery management (optional)

SODIMM200 Card Edge Connector: Pin compatible to Trizeps IV, IV-M, IV-WL, V, VI and VII CPU modules

General Details

Operating Systems: Microsoft Windows Embedded Compact 7, 2013, Linux, Android

Voltage Supply: +3V3 DC (SODIMM) or +5V DC and battery (FX11)

Operating Temperature: -40°C bis +85°C (industrial)

Board Dimensions: 67.6 x 36.7 x 6.4 mm (incl. μSD Socket)

Environmental Standard: RoHS, REACH, WEEE

Availability: 10 years form, fit, function*

Technical modifications reserved, errors excepted
*beginning product life circle

Compatible with


7.0" Build-in Touch Panel Computer
i-PAN XT-Pro 10

10.1" Build-in Touch Panel Computer

Compact 7.0" Touch Panel Computer with metal assembly frame

Modular touch panel computer

Compact Trizeps SODIMM 200 Baseboard

Very multifunctional Trizeps VII SODIMM 200 Baseboard

Compact and scalable Trizeps VII SODIMM 200 Baseboard
Trizeps VII

NXP i.MX 6 SODIMM 200 CPU module (Quad, Dual, DualLite, Solo)