In a tight space the Trizeps VII provides almost the full performance potential and entire interface variety of the NXP i.MX6 processor. Nearly all connection pins of the processor have functions assigned to them and can be accessed via PinMUX and equipment options. That makes the Trizeps VII one of the world's most variable and compact i.MX6 CPU modules.
NXP i.MX6 ARM Cortex A9 (before Freescale), MP-CPU, 800 MHz up to 1.0 GHz per Core, 1 MB L2 Cache
Options: Quad (Q), Dual (D), DualLite (U) and Solo (S)
4 x 16 Bit DDR3-1066 (533 MHz), 64 Bit 1 CS
Options: 256 MByte up to 2 GByte, 64 Bit
Onboard 4 Bit wide μSD Socket (standard) or onboard 8 Bit wide eMMC (on request) – not all available at the same time
Additional assembly option on request: Onboard SPI NOR Flash
Options: μSD 4 GB (up to 32 GB) – eMMC-Type: 4 GB (up to 64 GB) – NOR Flash up to 512 Mbit
Onboard WiFi-Bluetooth module, fits four different Lesswire module types (optional)
Options: IEEE 802.11 a/b/g/n/e/i/h/d/k/r/w, +18 dBm, 72 Mbps (20 MHz) and up to 150 Mbps (40 MHz), Bluetooth 3.0+ EDR
Display Interfaces: HDMI v1.4, 2 x LVDS, LCD 24 Bit RGB, MIPI (supports 3D, 4k x 2k and 2 x 1080p Displays)
Interfaces: USB 2.0 Host and OTG, 2 x FlexCAN, S-ATAII, PCIe, 2 x 4 Bit wide SDIO, RTC, SPDIF, Adress-Data-Bus, 3 x UARTs, 2 x I2C, 2 x SPI, GPIOs, 2 x PWMs
Ethernet: Onboard 10/100 Mbit RMII PHY and 10/100/1000 Mbit RGMII interface (can not be used at the same time)
Extension Connector: Additional FX11 60pol. high-speed board to board connector
Camera Interfaces: 8bit parallel camera and MIPI serial camera (supports 2 x cameras at the same time)
Audio Codec: AC´97 Audio Codec with 4/5 wires res. Touch and 4 x 12 Bit ADC (2 x comparator inputs for battery monitoring), Stereo: Line-in, Mic-in, Speaker-out, Headphone out
Power: High-Eff. PMIC with single supply controlled by I2C
SODIMM200 Card Edge Connector: Pin compatible to Trizeps IV, IV-M, IV-WL, V and VI CPU modules
System Software: E-Boot, U-Boot, Barebox, UEFI / Windows 10 IoT Core, Windows Embedded Compact 7, 2013 – Linux Kernel 3.035, 4.1, 4.4 – Ubuntu 16.04, 18.04, LXDE, Yocto – Android 4.2.2, 6.0
Voltage Supply: +3V3 DC
Operating Temperature: -40°C bis +85°C (industrial), -20°C bis +85°C (extended consumer)
Board Dimensions: 67.6 x 36.7 x 6.4 mm (incl. μSD Socket)
Environmental Standard: RoHS, REACH, WEEE
Availability: 10 years form, fit, function*
Technical modifications reserved, errors excepted
*beginning product life circle
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