Trizeps VIII

CPU Module with processor from the i.MX8 series

The new Trizeps VIII uses the i.MX 8M processor from the NXP i.MX8 series. The CPU Module provides the high performance demands of current video, voice, and audio processing, either for industrial or home automation, streaming audio applications, or for modern imaging devices.

Trizeps VIII with NXP i.mx8 Front
Trizeps VIII with NXP i.mx8 Back


CPU: NXP™ i.MX 8M with Arm® Quad-/Dual-Core Cortex™ A53 at up to 1.5GHz (consumer), 1.3GHz (industrial), integrated Cortex M4

MCU: NXP Kinetis V Arm® Cortex-M0+ at up to 75MHz / 8x 16bit ADC, CAN, UART, SPI, GPIO etc. (optional)

RAM Memory

Up to 8 GByte LPDDR4-3200, 32Bit

Flash Storage

Onboard 4 Bit wide μSD Card Socket (recommendation) or onboard 8 Bit wide eMMC – not available at the same time

Wireless Communication

Onboard WiFi-Bluetooth module (optional): WiFi 2.4GHz/5Ghz (optional), WLAN 802.11 a/b/g/n/ac 2x2 MU-MIMO / Bluetooth 4.2, 5.0, external chipsets for wireless communication can be connected via SDIO, PCIe or
USB interfaces

Onboard Features

Display Interfaces: HDMI v2.0a, MIPI display (4ch), Single-, Dual-LVDS or LCD 24 Bit RGB, supports displays up to 4k resolution

Interfaces: 2x USB3.0 OTG, PCIe, 4Bit wide SDIO, SPDIF In/Out, I2S, Multichannel Serial-Audio-Interface, 4 UARTs, 2x I2C, SPI, QSPI, GPIOs, PWM

Ethernet: Onboard 10/100MBit/1GBit RGMII PHY or SIOP interface

FPGA: Programmable FPGA with up to 4300 LUTs to convert parallel display/camera/data-streams to MIPI DSI/CSI (optional)

Extension Connector: Additional FX11 60pol. high-speed board to board connector

Camera Interfaces: 8bit parallel, MIPI (4ch and additional 2ch)

Audio Codec: Stereo Headphone output, Mono Speaker output, Stereo Line-In, Microphone input

Power: High-Eff. PMIC with single supply controlled by I2C

SODIMM200 Card Edge Connector: Pin compatible to Trizeps SODIMM-200 CPU modules

General Details

System Software: Linux Kernel 4.14, Android 9, Windows 10 IoT Core

Voltage Supply: +3V3 DC

Operating Temperature: -40 bis 85°C (industrial) / -25 bis 85°C (Extended Consumer) / 0 bis 70°C (Consumer)

Board Dimensions: 67.6 x 36.7 x 6.4 mm (W x H x D)

Environmental Standard: RoHS, REACH, WEEE

Availability: 10 years form, fit, function*

Technical modifications reserved, errors excepted
*beginning product life circle

Compatible with


Compact and scalable Trizeps SODIMM 200 Baseboard

Compact Trizeps SODIMM 200 Baseboard
i-PAN T7

Compact 7.0" Touch Panel Computer with metal assembly frame
i-PAN T7 CoverLens

Modular 7.0" Touch Panel Computer
i-PAN T10 CoverLens

Modular 10.1" Touch Panel Computer
Trizeps VIII Mini

NXP i.MX 8M Mini SODIMM 200 CPU module
Trizeps VIII Nano

NXP i.MX 8M Nano SODIMM 200 CPU module
Trizeps VII

NXP i.MX 6 SODIMM 200 CPU module (Quad, Dual, DualLite, Solo)