The new Trizeps VIII uses the i.MX 8M processor from the NXP i.MX8 series. The CPU Module provides the high performance demands of current video, voice, and audio processing, either for industrial or home automation, streaming audio applications, or for modern imaging devices.
CPU: NXP™ i.MX 8M with ARM® Quad-/Dual-Core Cortex™ A53 at up to 1.5GHz (consumer), 1.3GHz (industrial), additional Cortex M4
MCU: NXP Kinetis V ARM® Cortex-M0+ at up to 75MHz / 8x 16bit ADC, CAN, UART, SPI, GPIO etc.
Up to 8 GByte LPDDR4-3200, 32Bit
Onboard 4 Bit wide μSD Socket (standard) or onboard 4 Bit wide μSD Card Socket (on request) – not available at the same time
Onboard WLAN-Bluetooth module, WLAN 2.4GHz/5Ghz (optional), WLAN 802.11 a/b/g/n/ac 2x2 MU-MIMO / Bluetooth 4.2, 5.0
Display Interfaces: HDMI v2.0a, MIPI display (4ch), Single-, Dual-LVDS or LCD 24 Bit RGB, supports displays up to 4K
Interfaces: 2x USB3.0 OTG, PCIe, 4Bit wide SDIO, SPDIF In/Out, I2S, Multichannel Serial-Audio-Interface, 4 UARTs, 2x I2C, SPI, QSPI, GPIOs, PWM
Ethernet: Onboard 10/100MBit/1GBit RGMII PHY or SIOP interface
FPGA: Programmable FPGA with up to 4300 LUTs to convert parallel display/camera/data-streams to MIPI DSI/CSI (optional)
Extension Connector: Additional FX11 60pol. high-speed board to board connector
Camera Interfaces: 8bit parallel, MIPI (4ch and additional 2ch)
Audio Codec: Stereo Headphone output, Mono Speaker output, Stereo Line-In, Microphone input
Power: High-Eff. PMIC with single supply controlled by I2C
SODIMM200 Card Edge Connector: Pin compatible to Trizeps SODIMM-200 CPU modules
System Software: Linux Kernel 4.14, Android 9, Windows 10 IoT Core (coming soon)
Voltage Supply: +3V3 DC
Operating Temperature: -25°C bis +85°C (industrial)
Board Dimensions: 67.6 x 36.7 x 6.4 mm (incl. μSD Socket)
Environmental Standard: RoHS, REACH, WEEE
Availability: 10 years form, fit, function*
Technical modifications reserved, errors excepted
*beginning product life circle
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