Trizeps VIII Mini

CPU Module with NXP i.MX 8M Mini processor

  • NXP i.MX 8M ARM 53 CPU up to 1.8 GHz, with additional Cortex M4
  • Configurable FPGA (up to 4300 LUTs), e.g. with MIPI to RGB converter
  • NXP Kinetis V ARM Cortex M0+ MCU provides additional interfaces like CAN, ADC, SPI, I2C
  • Up to 4 GByte LPDDR4-3200 RAM, 32 Bit
  • 1 GBit Ethernet, USB 2.0
  • Onboard WLAN/Bluetooth module
  • LVDS Transceiver (Single or Dual)
  • Low power consumption via 14nm LPC FinFET technology
  • Each CPU module passes through a multi-stage test: AOI/MOI, JTAG/Boundary Scan Test, Functional Tests
  • Available with Linux and Android operating systems, Windows 10 IoT Core is announced.
Trizeps VIII Mini with NXP i.mx 8m mini Front
Trizeps VIII Mini with NXP i.mx 8m mini Back

Processors

CPU: NXP™ i.MX 8M Mini with Arm® Quad-Core Cortex™ A53 at up to 1.8GHz (consumer), 1.6GHz (industrial), with additional Cortex™ M4

MCU: NXP™ Kinetis V Arm® Cortex™ M0+ at up to 75MHz / 8x 16bit ADC, CAN, UART, SPI, GPIO etc.

RAM Memory

Up to 8 GByte LPDDR4-3200, 32Bit

Flash Storage

Onboard 4 Bit wide μSD Card Socket (recommendation) or onboard 8 Bit wide eMMC – not available at the same time

Wireless Communication

Onboard WLAN-Bluetooth module, WLAN 2.4 GHz / 5Ghz, 802.11 a/b/g/n/ac 2x2 MU-MIMO / Bluetooth 4.2, 5.0

Onboard Features

Display Interfaces: MIPI display (4ch), Single-, Dual-LVDS or LCD 24 Bit RGB

Interfaces: 2x USB2.0 OTG, PCIe (routed to SODIMM socket or connected to WLAN-Bluetooth module), 4 Bit wide SDIO, SPDIF In/Out, I2S, Multichannel Serial-Audio-Interface, 4x UART, 2x I2C, SPI, QSPI, GPIOs, PWM

Ethernet: Onboard 10/100MBit/1GBit RGMII PHY or SIOP interface

FPGA: Programmable FPGA with up to 4300 LUTs to convert parallel display/camera/data-streams to MIPI DSI/CSI (optional)

Extension Connector: Additional FX11 60pol. high-speed board to board connector

Camera Interfaces: 8bit parallel, MIPI Camera (4ch)

Audio Codec: Stereo Headphone output, Mono Speaker output, Stereo Line-In, Microphone input

Power: High-Eff. PMIC with single supply controlled by I2C

SODIMM200 Card Edge Connector: Pin compatible to Trizeps SODIMM-200 CPU modules

General Details

System Software: Linux Kernel 4.14, Android 9, Windows 10 IoT Core (coming soon)

Voltage Supply: +3V3 DC

Operating Temperature: -25°C bis +85°C (industrial)

Board Dimensions: 67.6 x 36.7 x 6.4 mm (incl. μSD Socket)

Environmental Standard: RoHS, REACH, WEEE

Availability: 10 years form, fit, function*

Technical modifications reserved, errors excepted
*beginning product life circle

Compatible with

pConXS

Compact and scalable Trizeps SODIMM 200 Baseboard
iP5-Base

Compact Trizeps SODIMM 200 Baseboard
i-PAN T7

Compact 7.0" Touch Panel Computer with metal assembly frame
i-PAN T7 CoverLens

Modular 7.0" Touch Panel Computer
i-PAN T10 CoverLens

Modular 10.1" Touch Panel Computer
Trizeps VIII

NXP i.MX 8M SODIMM 200 CPU module (Quad, Dual)
Trizeps VIII Nano

NXP i.MX 8M Nano SODIMM 200 CPU module (coming soon)
Trizeps VII

NXP i.MX 6 SODIMM 200 CPU module (Quad, Dual, DualLite, Solo)
Overview CPU modules