Trizeps VIII Mini

CPU Module with NXP i.MX 8M Mini processor

  • NXP i.MX 8M ARM 53 CPU up to 1.8 GHz, with additional Cortex M4
  • Configurable FPGA (up to 4300 LUTs), e.g. with MIPI to RGB converter
  • NXP Kinetis V ARM Cortex M0+ MCU provides additional interfaces like CAN, ADC, SPI, I2C
  • Up to 4 GByte LPDDR4-3200 RAM, 32 Bit
  • 1 GBit Ethernet, USB 2.0
  • Onboard WLAN/Bluetooth module
  • LVDS Transceiver (Single or Dual)
  • Low power consumption via 14nm LPC FinFET technology
  • Each CPU module passes through a multi-stage test: AOI/MOI, JTAG/Boundary Scan Test, Functional Tests
  • Available with Linux and Android operating systems, Windows 10 IoT Core is announced.
Trizeps VIII Mini with NXP 8m mini Front
Trizeps VIII Mini with NXP 8m mini Back


CPU: NXP™ i.MX 8M Mini with Arm® Quad-Core Cortex™ A53 at up to 1.8GHz (consumer), 1.6GHz (industrial), with additional Cortex™ M4

MCU: NXP™ Kinetis V Arm® Cortex™ M0+ at up to 75MHz / 8x 16bit ADC, CAN, UART, SPI, GPIO etc.

RAM Memory

Up to 4GByte LPDDR4-3200, 32Bit

Flash Storage

Onboard 4 Bit wide μSD Card Socket (recommendation) or onboard 8 Bit wide eMMC – not available at the same time

Wireless Communication

Onboard WLAN-Bluetooth module, WLAN 2.4 GHz / 5Ghz, 802.11 a/b/g/n/ac 2x2 MU-MIMO / Bluetooth 4.2, 5.0

Onboard Features

Display Interfaces: MIPI display (4ch), Single-, Dual-LVDS or LCD 24 Bit RGB

Interfaces: 2x USB2.0 OTG, PCIe (routed to SODIMM socket or connected to WLAN-Bluetooth module), 4 Bit wide SDIO, SPDIF In/Out, I2S, Multichannel Serial-Audio-Interface, 4x UART, 2x I2C, SPI, QSPI, GPIOs, PWM

Ethernet: Onboard 10/100MBit/1GBit RGMII PHY or SIOP interface

FPGA: Programmable FPGA with up to 4300 LUTs to convert parallel display/camera/data-streams to MIPI DSI/CSI (optional)

Extension Connector: Additional FX11 60pol. high-speed board to board connector

Camera Interfaces: 8bit parallel, MIPI Camera (4ch)

Audio Codec: Stereo Headphone output, Mono Speaker output, Stereo Line-In, Microphone input

Power: High-Eff. PMIC with single supply controlled by I2C

SODIMM200 Card Edge Connector: Pin compatible to Trizeps SODIMM-200 CPU modules

General Details

System Software: Linux Kernel 4.14, Android 9, Windows 10 IoT Core (coming soon)

Voltage Supply: +3V3 DC

Operating Temperature: -25°C bis +85°C (industrial)

Board Dimensions: 67.6 x 36.7 x 6.4 mm (incl. μSD Socket)

Environmental Standard: RoHS, REACH, WEEE

Availability: 10 years form, fit, function*

Technical modifications reserved, errors excepted
*beginning product life circle

Compatible with


Compact and scalable Trizeps SODIMM 200 Baseboard

Compact Trizeps SODIMM 200 Baseboard
i-PAN T7

Compact 7.0" Touch Panel Computer with metal assembly frame
i-PAN T7 CoverLens

Modular 7.0" Touch Panel Computer
i-PAN T10 CoverLens

Modular 10.1" Touch Panel Computer
Trizeps VIII

NXP i.MX 8M SODIMM 200 CPU module (Quad, Dual)
Trizeps VII

NXP i.MX 6 SODIMM 200 CPU module (Quad, Dual, DualLite, Solo)