Trizeps VIII Plus

SODIMM-200 CPU-Module with NXP i.MX 8M Plus SoC

The new Trizeps VIII Plus CPU module uses the new i.MX 8M Plus processor from the NXP i.MX8 series. The i.MX 8M Plus SoC (System on Chip) has various processor units that can handle a wide range of computing operations.

Trizeps VIII Plus front
Trizeps VIII Plus rear

Processors

SoC: NXP™ i.MX 8M Plus with Arm® Cortex A53 Quad-Core CPU up to 1.8 GHz (consumer), 1.6 GHz (industrial), integrated Arm® Cortex M7 Co-Processor up to 800 MHz for Low-Power and Realtime applications, integrated NPU (Neural Processing Unit) with 2.3 TOP/s, 2 integrated ISPs (Image Signal Processor), resolution up to 12 MPixels and input rate up to 375 MPixels/s

MCU (optional)): NXP™ Kinetis V Arm® Cortex-M0+ up to 75 MHz / 8x 16 Bit ADC, UART, SPI, GPIO, I2C etc.

RAM Memory

Up to 8 GByte LPDDR4-4000, 32 Bit

Flash Storage

Onboard 4 Bit wide μSD Card Socket or onboard 8 Bit wide eMMC

Wireless Communication

Onboard WiFi/Bluetooth module, WiFi 2.4 GHz / 5Ghz, 802.11 a/b/g/n/ac 2x2 MU-MIMO / Bluetooth 4.2, 5.0 / External chipsets for wireless communication can be connected via SDIO, PCIe or USB interfaces (optional)

Onboard Features

Interfaces: 2x USB 3.0 OTG, PCIe (routed to SODIMM socket or connected to WiFi-Bluetooth module), 3x 4 Bit wide SDIO 3.0, SPDIF In/Out, I2S, Multichannel Serial-Audio-Interface, 4x UART, 2x I2C, SPI, QSPI, GPIOs, PWMs, 2x CAN

Ethernet: Onboard 10/100MBit/1GBit RGMII PHY / Additional 10/100MBit/1GBit RGMII interface

FPGA (optional): Programmable FPGA, up to 4300 LUTs

Display: Interfaces: HDMI, MIPI display (4 channel) / Single- or Dual-LVDS, LCD 24 Bit RGB GPU: 16 GFLOPS (high-precision) OpenGL® ES 3.1/3.0, Vulkan®, Open CL™ 1.2 FP, OpenVG™ 1.1 Video-Decoder: 1080p60, h.265/4, VP9, VP8

Camera Interfaces: 2x MIPI-CSI (4 channel) / Video Encoder: 1080p60, h.265/4

Audio Codec: Digital: 18x I2S TDM, DSD512, S/PDIF Tx + Rx, 8 channel PDM Microphone input Analog: Stereo Headphone output, Mono Speaker output, Stereo Line-In, Microphone input

Power: High-Eff . PMIC with single supply controlled by I2C

SODIMM Standard: SODIMM200 Card Edge connector, pin compatible to Trizeps SODIMM-200 CPU modules / FX11 60 pol. high-speed board to board connector

General Details

System Software: Linux Yocto, Debian / Android / Windows 10 IoT

Voltage Supply: +3V3 DC

Operating Temperature: -40 bis 85°C (industrial) / -25 bis 85°C (Extended Consumer) / 0 bis 70°C (Consumer)

Board Dimensions: 67.6 x 36.7 x 6.4 mm (W x H x D)

Environmental Standard: RoHS, REACH, WEEE

Availability: 10 years form, fit, function*

Technical modifications reserved, errors excepted
*beginning product life circle

Compatible with

pConXS

Compact and scalable Trizeps SODIMM 200 Baseboard
iP5-Base

Compact Trizeps SODIMM 200 Baseboard
i-PAN T7

Compact 7.0" Touch Panel Computer with metal assembly frame
i-PAN T7 CoverLens

Modular 7.0" Touch Panel Computer
i-PAN T10 CoverLens

Modular 10.1" Touch Panel Computer
Trizeps VIII

NXP i.MX 8M SODIMM 200 CPU module (Quad, Dual)
Trizeps VIII Nano

NXP i.MX 8M Nano SODIMM 200 CPU module
Trizeps VII

NXP i.MX 6 SODIMM 200 CPU module (Quad, Dual, DualLite, Solo)
Myon II

NXP i.MX 8M Mini CPU module
Overview CPU modules