LC-E, CAN or MC version
Technical data based on Trizeps IV, VI, VII CPU modules
NXP or Marvell processors from Single Core 312 MHz to 1.0 GHz up to DualLite 800 MHz
64 MByte SDRAM over 256 MByte DDR2 to 2 GByte DDR3-1066, 16/32/64 Bit
Onboard 8 Bit wide NOR flash / NAND flash 64 MB up to 256 MB,
onboard 8 Bit wide eMMC with 4GB up to 64GB and
onboard 4 Bit wide μSD Socket with 4GB up to 32GB Cards
Display Interfaces: Parallel 18 Bit RGB Display Port, resistive and capacitive touch
Features (depend on i-PAN7 version): 10/100 Mbit Ethernet, USB2.0 OTG (Trizeps VI, VII), USB1.1 OTG (Trizeps IV), SD/MMC Card Socket, Reset, 2.6W stereo speaker output (only CAN version), stereo headphone output, Microphone input, WLAN F-Antenna, LED, Realtime Clock with Backup Cap. / on request: analog video/camera input
Trizeps options: Onboard WLAN and Bluetooth modules, IEEE 802.11 b/g (Trizeps IV-WL,VI) or a/b/g/n/e/i/h/d/k/r/w, +18 dBm (Trizeps VII), 72 Mbps (20 MHz) and up to 150 Mbps (40 MHz), Bluetooth 2.0+ EDR (only Trizeps VI) or 3.0+ EDR (only Trizeps VII)
Only MC version: Onboard quad-band GSM/GPRS modem, GPS receiver
Extension Connectors (depend on i-PAN7 version): IO-Extension connector SMC-B-26 (only CAN version) and general interface connector SMC-B-80 (LC-E, CAN, MC version)
Extension interfaces (depend on i-PAN7 version): Power-in, FF-UART (COM1), BT-UART (COM2) or RS485 or modem, UART (TTL, 3V3), USB-Slave, USB-OTG, USB-Host, SDIO, GPIOs, 3x ADCs, LineIn, stereo headphone, Ethernet, I2C / only CAN version: 8 x +24V-IOs, CAN
Display: 7.0" TFT-Display 800 x 480 pixel, touch resistive or capacitive
Board Support Package: Windows Embedded CE 5.0, 6.0 R3, Compact 7 (Trizeps IV, VI, VII) / Windows Embedded Compact 2013, Android JB 4.2.2 - 1.1.0 ASOP, Linux Ubuntu 14.04 LTS (only Trizeps VII)
Voltage Supply: Industrial +12V supply
Support Level 1: Evaluation-Kit with BSP (binary), support on website /
Support Level 2: phone and email support for 180 days (at office time), basic hardware application notes /
Support Level 3: advanced hardware application notes, design kit including evaluation board schematics (NDA required)
Dimensions: 209 mm x 94 mm x 90 mm (W x H x D)
Include: i-PAN7, Trizeps CPU-Module, μSD Card, solid bases, power supply
Technical modifications reserved, errors excepted
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