The new Trizeps VIII Mini CPU Module from the NXP i.MX8 series uses the i.MX 8M Mini processor, which provides the high performance demands of current video, voice, and audio processing, including video resolutions up to 1080p. The NXP iMX8M Mini CPU is produced in the 14nm LPC FinFET technology, which enables high operating frequencies in combination with a low power consumption.
The Trizeps VIII Mini adds further features with the configurable FPGA, the programmable NXP Kinetirs Cortex M0+ MCU, the LVDS transceiver and the onboard WLAN/Bluetooth module. This integrates e.g. CAN, ADC, SPI, I2C interfaces as well as RBG and LVDS displays in addition to the iMX8M Mini CPU functionality.
Therefore, the Trizeps VIII Mini is the ideal CPU module for typical embedded solutions such as industrial-/ home automation, robotics, automotive, medical, aerospace, retail and is also ideally suitable for current streaming, audio applications, modern imaging devices or handhelds as well as battery-powered solutions.
Available with Linux, Android and Windows 10 IoT Core operating systems.
1 NXP i.MX 8M Mini Arm Cortex A53 CPU up to 1.8 GHz (Quad-Core), integrated Cortex M4 – 2 LPDDR4-3200 RAM (32 Bit, up to 8 GByte) – 3 SODIMM 200 Connector, Interfaces: UART (4x), SPI, SDIO, QSPI, I2C (3x), GPIO, PWM, USB 2.0 (2x), Headphone (stereo), Line-In (stereo), Microphone, Speaker, SPDIF In/Out, Serial Multichannel Audio, PCM, PCIe (routed to SODIMM socket or connected to WLAN-Bluetooth module), FPGA configurable pins (e.g. display RGB16/18/24, SPI/UART/GPIO, parallel camera), Kinetis MCU Pins (e.g. CAN, ADC 16 bit, UART, SPI), Ethernet (1 Gbit, 100/10 Mbit), +3V3 power supply – 4 Socket for μSD cards (4 Bit, lockable, recommendation) or eMMC (8 Bit), not available at the same time – 5 WLAN / Bluetooth UFL Coax connector – 6 WLAN / Bluetooth UFL Coax connector – 7 WLAN-Bluetooth Module (optional): 802.11 a/b/g/n/ac 2x2 MU-MIMO (2.4 GHz, 5 Ghz) / Bluetooth 4.2, 5.0 – 8 Power Management IC (PMIC) – 9 Single or Dual LVDS Transceiver – 10 1 Gbit Ethernet Phy – 11 NXP Kinetis MCU, Cortex M0+ – 12 High-Speed board-to-board connector, Interfaces: Mipi DSI (4 channel), Single or Dual LVDS, 1x Mipi CSI (4 channel), Ethernet SIOP – 13 HiFi Audio Codec – 14 FPGA up to 4300 LUTs (optional) – 15 JTAG (i.MX 8M Mini CPU) – 16 JTAG (FPGA and MCU)
Constantly high quality through multi-stage test of each individual CPU module
To ensure a constantly high quality, each individual CPU module is passed through a multi-stage test. The test result covers 100% of all interfaces.
• AOI/MOI: Multiple automatic and manual optical control of each CPU module during the production.
• JTAG/Boundary Scan Test: JTAG/Boundary Scan Test: The signal of each pin which is accessible via the JTAG chain is checked for connection, shorts, missing pull-up/down resistors. The DDR Ram is tested for row/column pin assignment.
• Functional tests of high-speed and analog interfaces (Ethernet, display, USB, audio, etc.) which are not testable via JTAG
The Trizeps VIII Mini includes the Keith & Koep SODIMM 200 Standard, the world‘s longest existing SODIMM standard. Like no other module standard, the SODIMM 200 ensures the pin compatibility of the Trizeps modules. The main difference of the Trizeps VIII Mini is the missing address/data bus, which is no longer supported by the i.MX 8M Mini CPU. The pins, which are no longer needed for this function, are used for GBit Ethernet signals. Trizeps VIII Mini and Trizeps VIII are mostly pin compatible.